10 Best Reball Steel Lpddr4 In The Us - Black Friday 2024
Best Choice1
WhatavalWhataval 90mm BGA Reball Rework Station w/56PCS Commonly Used Reballing Stencils Kit
Main highlights- Made by robust aluminium casting and anodized coating finishing
- BGA manual welding for plant tin rework of notebook computer CPU and mobile phone digital products
- BGA Reball station for manual soldering, use stencil size 90*90mm, light and durable
9.7Exceptional
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Value for Money2
WifehelperHT-90X BGA Reballing Station Reball Kit Aluminium Alloy Auto Magnet Stencil Solder Rework Table Plant Soldering Station
Main highlights- The station can match different stencils that can be used for corresponding BGA of different sizes.
- It has automatic centering function, rotate spiral plate, four position holes, four clamping blocks lock chip at same time, no need to adjust one by one.
- It can match 80*80mm and 90*90mm stencils(not included), high efficiency, wide suitability.
- Good positioning accuracy, fast clamping speed and high efficiency.
- Aluminum alloy structure, the structure is light and .
9.5Excellent
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3
Hyuduo27Pcs/Set BGA Universal Stencils Reballing Reball Rework Net Heated Template Set Tin Plant Stainless Steel for CPU Repair Tools
Main highlights- 【Wide Range of Applications】The reball stencils template is suitable for BGA heavy ball general molds of desktop laptops, game consoles, etc. to be directly heated and reworked for general chip repair.
- 【High-quality Materials】The BGA template is made of high-quality stainless steel, and the thickness of the steel mesh is very good.
- 【High Reliability】The universal stencils can be directly heated by a hot air blower to improve performance and reliability.
- 【Good Matching】The mold area of the worktable matches the area of the BGA chip, which can reduce the waste of solder balls.
- 【Easy to Use】These templates are not easily deformed when heated and can be easily blown up with a hot air blower.
9.2Excellent
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4
FafeicyReballing Stencil, Reballing Stencil Stainless Steel Phone CPU Reball Rework Template Screen for Samsung A60 to A90, Soldering Stations
Main highlights- for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
- Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very for long term using.
- Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
- Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
- Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60‑A90 series, A10S, A605F, A705F and more.
9.0Excellent
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5
BeuiouerBeuiouer BGA Reballing Directly Heat Stencils Solder Paste Tin Balls Station Steel Mesh BGA Reball Kit for SMT Rework Repair, Silver
Main highlights- This set including the planting platform, steel mesh, tin balls, hex wrench, brush, etc.
- Metal plating structure, light weight, , precision bearing capacity.
- High precision BGA universal stencils can be heated directly.
- A log planting platform can be used in combination with different log planting steel meshes, and BGA bales of different sizes can be planted.
8.9Very Good
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6
WhatavalWhataval 5 Bottle 25K Leaded BGA Soldering Balls Reball Reballing Tin Ball Sn63% Pb37% (25000pcs/bottle) for GPU CPU IC Chip Soldering Rework
Main highlights- Very Useful: These tin balls are used for connection of semiconductor chip, circuit module and PCB board, helpful for your soldering work.
- Temperature: When soldering, please make sure that if for Lead-Free chips is 245℃--260℃ (Maximum); for Leaded chips is 180℃--205℃ (Maximum)
- Solder Ball Alloy: Sn63% Pb37%
- High Quality: 5 Bottle BGA Solder Balls 25k/bottle for soldering rework, durable material for a long time use, widely applicable to all kinds of electronic products.
- Diameter: 0.4mm 0.45mm 0.5mm 0.6mm 0.76mm
8.8Very Good
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7
WalfrontTin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls Reball Ball BGA Ball for GPU CPU IC Chip PCB(9 bottles 0.3mm-0.76mm)
Main highlights- This tin solder ball brand new and high quality, material for a long time use.
- They are quite small and can transmit electronic , very useful for your soldering work.
- These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
- There are many different sizes you can choose, and you can choose 9 bottles to get them all.
- Each bottle contains about 25000 solder balls that will meet your basic soldering need.
8.7Very Good
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8
HilitandBGA Reballing Station, Aluminum Alloy Universal Ball Rework Table Tin Planting Blue with Handle
Main highlights- 【WELL DESIGNED】 Correspond to different sizes, this reballing station supports that the maximum chip size is 50 x 50mm.Due to onegroove at upper cover, excess solder balls can be easily removed, practical.
- 【SERVICE FOR YOU】 A type of chip soldered on the circuit board is a soldered chip. The characteristic of the chip is that the pins are not around, but the tin beads arranged in a matrix at the bottom of the chip are used as pins. This kind of chip soldering is also better than other types of chip soldering. The welding difficulty is much higher, not easy to mount and solder, also not easy to detect the problem and not easy to repair.
- 【SCOPE OF APPLICATION】 Mobile phone chip, Reballing station can be used for different molds, applicable to mobile phone chip, such reballing station works as one kind of planting tin station.
- 【PRODUCT MATERIAL】 Aluminum alloy, Lightweight and durable universal ball rework table adopts aluminum alloy structure.
- 【PACKAGE LIST】 1 x Reballing Station, 1 x Hex Wrench, 10 x Universal Steel Mesh.
8.6Very Good
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9
FocketBGA Stencil Reballing Holder Station Kit,Aluminum Alloy Universal BGA Reballing Station Solder Rework Kit with Handles+Stencils+Balls Kit
Main highlights- The upper cover has a which is convenient for removal of excess tin balls.
- One reballing station can be used with different stencils.
- Can correspond to BGA of different sizes, maximum chip size is 50*50mm.
- BGA chip secedes steel stencils size is 90*90mm.
- Aluminum alloy structure, the structure is light and .
8.5Good
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10
Newzoll130Pcs Universal Directly Heat BGA Reballing Net Stencils Templates Kit for Soldering Accessories Adopt 304 Stainless Steel Plate.
Main highlights- These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate
- The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball.
- It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
- Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform.
- Can be heated by the hot air machine, these stencils are not easy to deform when heated
8.4Good
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