10 Best New Reball Pcs In The Us - Black Friday 2024
Whataval 90mm BGA Reball Rework Station w/56PCS Commonly Used Reballing Stencils Kit
Main highlights- Made by robust aluminium casting and anodized coating finishing
- BGA manual welding for plant tin rework of notebook computer CPU and mobile phone digital products
- BGA Reball station for manual soldering, use stencil size 90*90mm, light and durable
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Whataval 90mm 56PCS BGA Reballing Kit for Laptop and PS3 XBOX Gameplayer with A Reballing Station Easy to Use
Main highlights- WIDE RANGE OF APPLICATIONS -- The reball stencils template is suitable for BGA heavy ball general molds of desktop laptops, game consoles, etc. to be directly heated and reworked for general chip repair
- REBALLING STATION -- The reballing station is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering
- PERFECT MATCH -- The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. TIPS: Leaded solder ball melting point 183 degrees
- EASY TO USE -- The specifications of BGA universal reballing stencil reballing templates set are marked on the surface, convenient for you to choose and use them on the reballing station
- 90*90MM STAINLESS STEEL -- 56 PCS/Set, these stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect, enough to meet your various needs, can be easily blown up by the hot air machine, cooperate with ordinary air gun and not easy to deform
Whataval 5 Bottle 25K Leaded BGA Soldering Balls Reball Reballing Tin Ball Sn63% Pb37% (25000pcs/bottle) for GPU CPU IC Chip Soldering Rework
Main highlights- Very Useful: These tin balls are used for connection of semiconductor chip, circuit module and PCB board, helpful for your soldering work.
- Temperature: When soldering, please make sure that if for Lead-Free chips is 245℃--260℃ (Maximum); for Leaded chips is 180℃--205℃ (Maximum)
- Solder Ball Alloy: Sn63% Pb37%
- High Quality: 5 Bottle BGA Solder Balls 25k/bottle for soldering rework, durable material for a long time use, widely applicable to all kinds of electronic products.
- Diameter: 0.4mm 0.45mm 0.5mm 0.6mm 0.76mm
Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls Reball Ball BGA Ball for GPU CPU IC Chip PCB(9 bottles 0.3mm-0.76mm)
Main highlights- This tin solder ball brand new and high quality, material for a long time use.
- They are quite small and can transmit electronic , very useful for your soldering work.
- These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
- There are many different sizes you can choose, and you can choose 9 bottles to get them all.
- Each bottle contains about 25000 solder balls that will meet your basic soldering need.
27Pcs/Set BGA Universal Stencils Reballing Reball Rework Net Heated Template Set Tin Plant Stainless Steel for CPU Repair Tools
Main highlights- 【Wide Range of Applications】The reball stencils template is suitable for BGA heavy ball general molds of desktop laptops, game consoles, etc. to be directly heated and reworked for general chip repair.
- 【High-quality Materials】The BGA template is made of high-quality stainless steel, and the thickness of the steel mesh is very good.
- 【High Reliability】The universal stencils can be directly heated by a hot air blower to improve performance and reliability.
- 【Good Matching】The mold area of the worktable matches the area of the BGA chip, which can reduce the waste of solder balls.
- 【Easy to Use】These templates are not easily deformed when heated and can be easily blown up with a hot air blower.
HT-90X BGA Reballing Station Reball Kit Aluminium Alloy Auto Magnet Stencil Solder Rework Table Plant Soldering Station
Main highlights- The station can match different stencils that can be used for corresponding BGA of different sizes.
- It has automatic centering function, rotate spiral plate, four position holes, four clamping blocks lock chip at same time, no need to adjust one by one.
- It can match 80*80mm and 90*90mm stencils(not included), high efficiency, wide suitability.
- Good positioning accuracy, fast clamping speed and high efficiency.
- Aluminum alloy structure, the structure is light and .
Beuiouer BGA Reballing Directly Heat Stencils Solder Paste Tin Balls Station Steel Mesh BGA Reball Kit for SMT Rework Repair, Silver
Main highlights- This set including the planting platform, steel mesh, tin balls, hex wrench, brush, etc.
- Metal plating structure, light weight, , precision bearing capacity.
- High precision BGA universal stencils can be heated directly.
- A log planting platform can be used in combination with different log planting steel meshes, and BGA bales of different sizes can be planted.
Leaded Solder Balls BGA Reballing 0.55mm 250 Thousand Grains Tin Balls Welding Accessories for Laptop Phone Repair
Main highlights- Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic with ultra‑small ball tin electronic parts, etc.
- Use bottled pack and small size, easy to carry and store, convenient to use and with good performance
- The solder with tin balls is more and can help you solder effectively
- Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit
- A large number, can meet your use and replacement needs, very practically
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