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Strengthened PMIC cooling design. On-die ECC for stable system. High-Quality ICs Selected for Stability & Reliability.
RGB colors & 120° ultra-wide lighting. Equipped with smart RGB IC controller that supports various lighting effect software. Power management ICs (PMICs) equipped for efficient power usage.
DDR5 - Leading the way into a new OC generation, supports Intel XMP3.0 for one-click overclocking. Compatible with Intel 600 & 700 Series Chipset
Ultra-thin 8.4mm design; the most lightweight design in the industry.
Equipped with the new-generation USB 3.2 Gen 1 (3.0/3.1) interface. Downward compatible with USB 2.0/USB 1.1 interfaces.
Easy sliding design with a durability of sliding over 10,000 times.
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Compact 22x30mm form, up to 5,000/3,500 MB/s speeds, advanced heat dissipation, PCIe Gen4 compatible, TB-grade capacity.
Ideal Use Cases
Perfect for upgrading STEAM Deck, lightweight devices needing high performance and capacity without compromising on size or system stability.
Customer Praise
Most reviews highlight its exceptional speed and reliability for gaming and high-end applications, along with easy installation and noticeable performance boost.
The PRO PLUS SDXC CARD has both UHS Speed Class 3(U3) and Video Speed Class V30 that never miss a single shot in continuous shooting mode
TEAMGROUP PRO high speed memory SD card with read/write: up to 160/120MB/s, makes your own story with 4K UHD video recording
High-performance transfer speeds up the workflow and the perfect protection from extreme environment functions such as waterproof, shockproof, X-ray proof and anti-static
RGB colors & 120° ultra-wide lighting. Equipped with smart RGB IC controller that supports various lighting effect software.
Power management ICs (PMICs) equipped for stable, efficient power usage. Strengthened PMIC cooling design. On-die ECC for stable system. High-Quality ICs selected for stability & reliability. Optimized for Both Intel XMP 3.0 & AMD EXPO.
Exclusive DDR5 memory for AMD. DDR5 - Leading the way into a new OC generation, compatible with AMD series chipset. AMD EXPO support for one-click overclocking. Compatible with AMD X670 series and Ryzen 7000 Series CPU.
Supports XMP2.0 one-click overclocking technology. Compatible with both Intel & AMD motherboards. QVL approved by all mainstream motherboard manufacturers.
Latest JEDEC RC 2.0 PCB. Energy saving 1.2V~1.4V ultra low working voltage.
Full frame 120° ultra wide angle lighting. Built-in Force Flow RGB lighting effect. Supports ASUS Aura Sync software synchronization. Supports variety kinds of lighting control software. Aluminum alloy heat spreader with asymmetric minimalist design.
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