Ps3 Stencils Reballings of 2025
- Best Choice
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WhatavalWhataval 90mm BGA Reball Rework Station w/56PCS Commonly Used Reballing Stencils Kit
Main highlights- Made by robust aluminium casting and anodized coating finishing
- BGA manual welding for plant tin rework of notebook computer CPU and mobile phone digital products
- BGA Reball station for manual soldering, use stencil size 90*90mm, light and durable
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WhatavalWhataval 90mm 56PCS BGA Reballing Kit for Laptop and PS3 XBOX Gameplayer with A Reballing Station Easy to Use
Main highlights- WIDE RANGE OF APPLICATIONS -- The reball stencils template is suitable for BGA heavy ball general molds of desktop laptops, game consoles, etc. to be directly heated and reworked for general chip repair
- REBALLING STATION -- The reballing station is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering
- PERFECT MATCH -- The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. TIPS: Leaded solder ball melting point 183 degrees
- EASY TO USE -- The specifications of BGA universal reballing stencil reballing templates set are marked on the surface, convenient for you to choose and use them on the reballing station
- 90*90MM STAINLESS STEEL -- 56 PCS/Set, these stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect, enough to meet your various needs, can be easily blown up by the hot air machine, cooperate with ordinary air gun and not easy to deform
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WhatavalWhataval 110pcs BGA Rework Stencils Universal Reballing Net Stencils, Steel Template Mesh Directly Heat Set Kit for Laptop, Desktop, Welding Accessories w/ 25k Balls
Main highlights- What is included: 110pcs heat-directly stencils, 1pc Heat directly reball station, 1pc Allen Key, 1pc Tin Shaving Pen,1pc Original Desoldering Wick(3.0mm*1.5m), 10x 25K solder balls (0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.55mm 0.6mm 0.65mm 0.76mm), 1pc 10mm*33m kapton tape
- Very Useful Bundle: High quality BGA lead solder tin balls for soldering rework, can be heated by the hot air machine and the stencils are not easy to deform when heated, come with a perfect bundle accessories for BGA soldering
- Intimate Service: If you have any dissatisfaction or questions, please feel free to contact us and we will, within 24 hours, arrange a best solution for you
- Excellent Stainless Steel: The stencils are made of high quality 304 stainless steel with perfect thickness, totally 110 PCS, enough to meet your various needs of soldering work
- Easy To Use: Designed for all kinds of BGA chips like laptop, desktop, communication main board north-south bridge, graphics cards and so on
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FocketBGA Rework Net,130pcs BGA Universal Reballing Rework Net Stencils Steel Template Mesh Directly Heat Set Kit for Laptop, Desktop, Etc
Main highlights- They can be heated by the hot air machine, these stencils are not easy to deform when heated
- These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect
- There are 6 different sizes and totally 130pcs, enough to meet your various needs
- The specifications are marked on the surface, convenient for you to choose
- It is specially designed for laptop, desktop, etc all kinds of BGA chips
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EllbestEllbest 36pcs BGA Reballing Stencils Rework Station, Universal Steel Template Mesh Directly Heat Set Kit for Laptop CPU Repair Tools
Main highlights- Wide range of uses: Because these stencil has stable structure and performance, and is widely used. The applicable fields are suitable for laptop, desktop, communication main board north-south bridge and graphics card, etc
- Not easy to deform: These BGA stencil set can be heated by hot air machine, and it is not easy to deform when heated
- Meet your various needs: These silver reballing templates can provide a variety of different sizes, 36pcs to meet your different needs
- Marked on surface: The specifications are marked on the surface, convenient for you to choose
- High-quality materials: These stencils are made of high-quality stainless steel plates as the main material, supplemented by complex and precise calcination processes, so that stencils has a suitable thickness and excellent performance
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OvenotBGA Reballing Stencils, 130pcs BGA Universal Reballing Rework Net Stencils Steel Template Mesh Directly Heat Set Kit
Main highlights- They can be heated by the hot air machine, these stencils are not easy to deform when heated
- These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect
- These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect
- These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect
- There are 6 different sizes and totally 130pcs, enough to meet your various needs
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MAYIWOBGA Stencils, 27pcs Universal Directly Heat BGA Reballing Net Stencils Templates for Soldering Accessories, Welding Accessories
Main highlights- � Specially Designed -- It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
- � Not Easy To Deform -- They can be heated by the hot air machine, these stencils are not easy to deform when heated. Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform.
- � 304 Stainless Steel -- These stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect. 27 PCS/Set, enough to meet your various needs.
- � 304 Stainless Steel -- These stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect. 27 PCS/Set, enough to meet your various needs.
- � 304 Stainless Steel -- These stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect. 27 PCS/Set, enough to meet your various needs.
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WalfrontBGA Reballing Universal Stencil BGA Rework Net Stencil Template Solder Steel Mesh Directly Heat Set Kit 0.3mm 0.35mm 0.4mm 0.5mm Phone BGA IC Chips Repair Tool
Main highlights- VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
- STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.
- POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
- FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
- COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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WalfrontReballing Stencils Stainless Steel Strong Magnetic Reballing Template for Phone Repair
Main highlights- STAINLESS STEEL: These reballing nets are made of stainless steel with good toughness, high strength, and and long service life.
- HIGH EFFICIENCY: Strong magnetic adsorption, fast tin planting, these reballing stencils will not change under high temperature, ensuring accurate positioning.
- FLEXIBLE TO USE: Adopt new magnetic power source positioning, automatic clamping, convenient and flexible, support various CPU positioning, stable and
- EASY : With compact size, these reballing nets are easy to carry, magnetic sliding cover opening and closing design for easy and good stability.
- 9PCS IN 1 SET: Including 9pcs stainless steel reballing stencils, with a variety of types, strong practicability, to meet more CPU maintenance needs.
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WalfrontBGA Reballing Station Rework Kit Universal Stencils for Laptop Desktop Game Player
Main highlights- WIDELY USED: One reballing station can be used with different stencils.
- SIZE: BGA chip secedes steel stencils size is 90*90mm.
- LIGHT AND : Aluminum alloy structure, the structure is light and .
- DETAILED: Can correspond to BGA of different sizes, maximum chip size is 50*50mm.
- CONVENIENCE: The upper cover has a which is convenient for removal of excess tin balls.